Main articles: Defining High-Speed Signal Paths with xSignals, xSignal Wizard ► Learn more about Extending Altium Designer Defining the High-Speed Signals
ALTIUM DESIGNER PCB LAYOUT PART 1 INSTALL
If it is not currently installed, click the Configure button to install it. If it is installed it will appear on the Installed list of the Extensions & Updates view, as shown below. The Signal Integrity analysis engine installs as a System Extension. ► Learn more about Impedance Matching the Components Note that measurements can be taken directly from the waveforms. The Signal Integrity analysis engine helps identify nets with potential reflection issues. The values of these components can then be further tuned once the post-layout signal integrity analysis has been performed. Nets with potential reflection problems can be identified and any additional termination components can be added to the schematic before proceeding to board layout. By carefully choosing this default length to reflect the dimensions of the intended board, you can gain a fairly accurate picture of the likely signal integrity performance of the design.
ALTIUM DESIGNER PCB LAYOUT PART 1 SIMULATOR
At this pre-layout stage of the design process, the signal integrity simulator cannot determine the actual length of particular connections so it uses a user-definable average connection length to make its transmission line calculations. When no board design is present, the tool allows you to set up the physical characteristics of the design, such as the desired characteristic trace impedance, from within the signal integrity simulator.
The simulator is based on a Fast Reflection and Crosstalk Simulator, which produces very accurate simulations using industry-proven algorithms.īecause both design capture and board design use an integrated component system that links schematic symbols to relevant PCB footprints, SPICE simulation models and signal integrity macro-models, signal integrity analysis can be run at the schematic capture stage prior to the creation of the board design. The signal integrity simulator models the behavior of the routed board by using the calculated characteristic impedance of the traces combined with I/O buffer macro-model information as input for the simulations. Since output pins are typically low impedance and input pins are typically high impedance, termination components may need to be added to the design to achieve impedance matching.Īltium Designer includes a signal integrity simulator that can be accessed during both the design capture and board layout phases of the design process, allowing both pre- and post-layout signal integrity analysis to be performed ( Tools » Signal Integrity). Pre- and Post-layout Signal Integrity AnalysisĮarly in the design process, it is important to identify signals that might require impedance matching so that additional termination components can be included before the component placement process is complete. Configuring and controlling the route lengths.The configuration and routing of differential pairs.The return path of each high-speed signal.The quantity and arrangement of the layers in the layer stack.The properties and dimensions of the board materials.The mechanical dimensions of the routes - for controlled impedance routing.The definition of the signals that need high-speed design rules applied to them.Termination components that may be required.The process of routing a board with high-speed signals requires you to manage: If you're interested in learning more about high-speed design, why not check out the Key Elements of High-Speed PCB Design. This article describes the various options and settings that you configure in Altium Designer to successfully design your high-speed board. High-speed printed circuit board design is a process of balancing the circuit design requirements, device technologies, and fabrication materials and methodologies, to deliver a PCB that can transfer signals between the components, with integrity. Parent page: Laying Out Your PCB High-Speed Design in Altium Designer Controlling and Tuning the Route Lengths.Configuring and Routing Differential Pairs.Managing Split and Multiple Power and Ground Planes.Managing the Return Path for High-Speed Signals.
Pre- and Post-layout Signal Integrity Analysis.